| 摘要 |
PURPOSE:To provide a TAB tape easy to prepare and excellent in electrical characteristics, by preventing current leakage between conductor patterns. CONSTITUTION:Metal layers 12, 14 are formed on both sides of an electrically insulating base film 10 to form a film material. Required holes, such as device hole, are formed in the resultant film material. The metal layer 14 formed on one side of the base film 10 is subjected to solder plating to form a solder plate layer 20 on the surface of the metal layer 14. The solder plate layer 20 is then heated, and a sheet of metal foil 24 is laminated thereon. The metal foil 24, the metal layer 14 that bonds the metal foil 24 to the base film 10 and the solder plate layer 20, are etched to form a conductor pattern. |
