发明名称 MANUFACTURE OF THIN FILM TRANSISTOR ARRAY DEVICE
摘要 <p>PURPOSE:To lessen manufacturing processes in number by a method wherein a connection terminal patterning process is carried out at the same time when a process wherein a source electrode, a drain electrode, and a second wiring or a display electrode are patterned is carried out. CONSTITUTION:A thin film transistor array device is possessed of a first wiring 2 which connects the gate electrodes 1a of thin film transistors together, a second wiring 5a which connects the source electrodes 5c of the thin film transistors together, and a connection terminal 5 which connects a display electrode 5b connected to the drain electrode 5d of the thin film transistor to an external circuit connected to the end of the first wiring 2. A process wherein a connection terminal 6 is patterned is carried out simultaneously with a process wherein the source electrode 5c, the drain electrode 5d, and the second wiring 5a or a display electrode 5b are patterned. By this setup, a thin film transistor array device can be lessened in number of manufacturing processes.</p>
申请公布号 JPH07183539(A) 申请公布日期 1995.07.21
申请号 JP19940134411 申请日期 1994.06.16
申请人 SEIKOSHA CO LTD 发明人 TANAKA SAKAE;WATANABE YOSHIAKI
分类号 G02F1/136;G02F1/1368;H01L21/336;H01L29/78;H01L29/786;(IPC1-7):H01L29/786 主分类号 G02F1/136
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