MODULE WITH CHIP DILECTLY ATTACHED

摘要

PURPOSE: To provide a method for fixing an electronic component onto a printed circuit board. CONSTITUTION: The direct chip affixing module DCAM 10 comprises one or a plurality of electronic components 30 bonded to a printed circuit on a substrate. The DCAM is bonded to an electronic circuit assembly through contact pads 50 formed on the fringe of a DCAM board. Consequently, solder bonding between the DCAM and the assembly can be visually inspected easily. The DCAM board 70 is provided in the form of a panel and vias 50 are drilled at specified contact points and plated. Subsequently, the DCAM is cut off from the panel and the cut vias provide contact pads 50 on the fringe of a subboard.