IMPROVED LOW-COST PACKAGE FOR ELECTRONIC COMPONENTS

摘要

A low-cost package (80) uses non-ceramic materials to environmentally seal an air chamber for an electronic component. The package includes a base (82) formed by a plurality of essentially flat terminals (D, S, G) molded in a polyphenylene sulfide resin (P) so as to provide a planar surface for surface mounting to a circuit board. A component placement area (108) on the base (82) receives a cap (60) which covers and seals the area (108) from contaminants.