| 摘要 |
PURPOSE:To easily package optical parts on the principal surface of a substrate by exposing at least one end face of an optical waveguide formed in the substrate to the principal surface of the substrate. CONSTITUTION:Four optical waveguides 12 in total are formed in a glass substrate 10, and each optical waveguide 12 consists of a linear part 12a, a bending part 12b, and a terminal part 12c. The end face of the linear part 12a is exposed to the end face of the glass substrate and is connected to an optical connector 33. This optical connector 33 is fitted and fixed to another device or optical circuit. The terminal part 12c is formed perpendicularly to principal surfaces 30 and 31 of the glass substrate 10, and an end face 14 of the terminal part 12c is exposed to the principal surface 30. A pair of guide holes 11 are formed at a prescribed angle, for example, 90 deg. to the pair of end faces 14 exposed to the principal surface 30. A photoelectronic integrated device 50 is packaged on this glass substrate 10 with an annular rubber cushion 8 between them. |
