| 摘要 |
PURPOSE:To provide a wafer polishing device suited for maintenance and inspection particularly in the periphery of a platen while maintaining high polishing accuracy. CONSTITUTION:One surface of a platen 14 is formed as a polishing surface, a head 17 and patch 18 for holding a wafer 23 are provided in a position opposed to each other by interposing the platen 14, the platen 14 is set up rotatably by a platen rotating motor 15, the head 17 is set up rotatably by a drive motor 34 and further horizontally movably by a head horizontally moving mechanism 24, a plurality of balls 38, 38,... are provided in the patch 18, and it is made horizontally movable by a patch horizontally moving mechanism 24b. An arm 16 for supporting the head 17 and patch 18 is set up vertically movably in a radial direction of the platen 14 by an arm vertically driving mechanism 25, and further a supporting part 16b of the arm 16 is set up rotatably in a reverse direction with a shaft part 16a serving as the center. |
