| 摘要 |
PURPOSE:To obtain an epoxy resin composition containing respective specific epoxy resin, phenolic resin hardener and epoxy-modified silicone oil, having excellent soldering stress resistance and fluidity and suitable for the sealing of a semiconductor. CONSTITUTION:This composition contains (A) an epoxy resin containing 50-100wt.% of a biphenyl-type epoxy resin of formula I (R1 to R8 each is H, a halogen or an alkyl), (B) 70-93wt.% (based on the totai composition) of an inorganic filter (preferably fused silica powder), (C) a phenolic resin hardener containing 30-100wt.% of a flexible phenolic resin hardener of formula II (R is p-xylylene; (n) is 0-8), etc., (D) a cure accelerator (e.g. triphenyl phosphine) and (E) 0.1-3wt.% (based on the total composition) of an epoxy-modified silicone oil of formula III [R1 is group of formula IV or formula V; A is group of formula VI or formula VH (R is a 1-4C alkylene); the epoxy equivalent of the epoxy group of the group A is 140-500]. |
