| 摘要 |
PURPOSE:To obtain a substrate intensive to one piece by providing imaging arrays of an imaging device, cathode drive ICs, and anode drive ICs on a single hard printed board. CONSTITUTION:LED arrays 2 are arranged on a hard printed board 6. On the both sides thereof, data buses 8, 8 are provided and subjected to wire bonding. The data bus 8 is divided for every two arrays and shaped into a U shape. The divided data buses 8, 8 are connected to each other by a through hole and a back surface wire 14. Anode drive ICs 3 are connected to the data bus 8. A common electrode wire 10 is provided in a space between the data buses 8, 8 and connecting to cathode drive ICs 4. |
