发明名称 Reduced semiconductor size package
摘要 A sealed semiconductor unit includes an electrical component within a defined area on a semiconductor material. A cover with the dimensions of the semiconductor defined area is placed over the semiconductor material with a sealant there between. The dimensions of the cover are aligned with the dimensions of the semiconductor. The sealed unit includes electrical contacts extending from outside the sealed unit to the electrical component within the sealed unit on the semiconductor material. The sealed semiconductor unit, including the cover, the semiconductor material, and the electrical component, has an area of the semiconductor material.
申请公布号 US5434357(A) 申请公布日期 1995.07.18
申请号 US19910831252 申请日期 1991.12.23
申请人 BELCHER, DONALD K.;ADKINS, CALVIN L. 发明人 BELCHER, DONALD K.;ADKINS, CALVIN L.
分类号 H01L21/50;H01L23/04;H01L23/31;H01L23/495;(IPC1-7):H01L23/28 主分类号 H01L21/50
代理机构 代理人
主权项
地址
您可能感兴趣的专利