发明名称 |
In-situ endpoint detection and process monitoring method and apparatus for chemical-mechanical polishing. |
摘要 |
An in-situ chemical-mechanical polishing process monitor apparatus (50) for monitoring a polishing process during polishing of a workpiece such as a silicon wafer (52) in a polishing machine, the polishing machine having a rotatable polishing table (62) provided with a polishing slurry (61), is disclosed. The apparatus comprises a window (72) embedded within the polishing table, whereby the window traverses a viewing path during polishing and further enables in-situ viewing of a polishing surface (58) of the workpiece from an underside of the polishing table during polishing as the window traverses a detection region along the viewing path. A reflectance measurement means (74) is coupled to the window on the underside of the polishing table for measuring a reflectance. To generate a reflectance signal representative of an in-situ reflectance, wherein a prescribed change in the in-situ reflectance corresponds to a prescribed condition of the polishing process. <IMAGE> |
申请公布号 |
EP0663265(A1) |
申请公布日期 |
1995.07.19 |
申请号 |
EP19940480152 |
申请日期 |
1994.11.24 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
LUSTIG, NAFTALI ELIAHU;SAENGER, KATHERINE LYNN;TONG, HO-MING |
分类号 |
G01N21/55;B24B37/013;B24B49/04;B24B49/12;B24D7/12;G01B11/06;H01L21/304;H01L21/66 |
主分类号 |
G01N21/55 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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