| 摘要 |
PURPOSE:To obtain an epoxy resin composition containing a hydroquinone-type epoxy compound and a phenolic resin hardener having respective specific structures and capable of remarkably improving the soldering stress resistance of a semiconductor package in the mounting on a substrate. CONSTITUTION:This epoxy resin composition contains (A) an epoxy resin containing 30-100wt.% of a hydroquinone-type epoxy compound of formula I (R1 and R2 each is a lower alkyl), (B) a phenolic resin hardener containing 30-100wt.% of a phenolic resin hardener of formula II (R1 and R2 each is H or a lower alkyl), (C) an inorganic filler (preferably fused silica powder and/or spherical silica powder) and (D) a cure accelerator (e.g. triphenyl phosphine) as essential components. The hardener of formula II is preferably produced by the condensation reaction of phenol with p-xylenes. The amount of the component C is preferably 80-93wt.% based on the total composition. |
