发明名称 INTEGRATED CIRCUIT STRUCTURE
摘要 PURPOSE: To provide a memory cube whose cost is reduced, that is miniaturized, and whose manufacturing process is simplified. CONSTITUTION: A memory cube with a plurality of memory chips 152 that have a plurality of data storage devices has an auxiliary circuit 161 with a non-active line termination circuit, and one or a plurality of auxiliary circuits are formed as one portion of the memory cube and are arranged with a gap between the memory chips. An external terminal that is connected to a memory input line, a control line, and a data writing line is provided at the auxiliary circuit chip while it is close to the termination point of each line. A decoupling capacitor 215 that is integrated at the auxiliary circuit chip is connected to a power supply buss in a memory cube structure and a heating resistor 218 is provided at the auxiliary circuit chip to maintain the temperature of the memory cube nearly constantly. A temperature detection diode 220 is incorporated into the auxiliary circuit chip, thus accurately detecting the internal temperature of the memory cube.
申请公布号 JPH07176685(A) 申请公布日期 1995.07.14
申请号 JP19940206503 申请日期 1994.08.31
申请人 INTERNATL BUSINESS MACH CORP <IBM> 发明人 MAIKERU FUOODO MATSUKUARISUTAA;JIEIMUSU AREKUSANDAA MAKUDONARUDO;GOODON JIEI ROBINSU;MADOHEIBUN SUWAMINASAN;GUREGORII MAATEIN UIRUKINSU
分类号 H01L25/18;G06F11/00;G11C5/00;H01L23/34;H01L25/065;H01L25/07;(IPC1-7):H01L25/065 主分类号 H01L25/18
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