| 摘要 |
PURPOSE:To reduce mounting defects caused by the variation of the heights of bumps formed on a flip chip by a method wherein the flip chip is mounted on a board for connection after the board is inclined with an angle so as to have the variation of the distances between the tips of the bumps and the board pads minimum. CONSTITUTION:The two-dimensional positions of all the bumps of a flip chip 1 are aligned beforehand with the two-dimensional positions of the pads of a board 2 which correspond to the bumps. The heights of all the bumps of the flip chip 1 which is attracted and held by a mounting head 4 are measured by a non-contact shape measurement unit 6 by driving an X-Y stage 7. An inclination angle calculating unit 8 calculates the optimum board inclination angle of the board 2 which makes the variation of the distances between the tips of the bumps and the board 2 minimum from the height data of all the bumps. The board 2 is inclined to have the optimum board inclination angle by a biaxial goniotable 9. Then a Z-stage 5 is made to descend and the flip chip 1 is mounted on the board 2 for connection. With this constitution, a chip having defective bumps can be detected before mounting. |
