CERAMIC CIRCUIT BOARD AND ITS MANUFACTURE

摘要

PURPOSE:To provide a ceramic circuit board which facilitates mounting of semiconductor devices and chip components with higher density and at lower cost. CONSTITUTION:The connection part of a ceramic circuit board for a semiconductor device 105 is formed on wirings 112 which are formed on the parts of copper wirings 108 and are mainly composed of gold and the other wirings are made of copper. A process in which patterns are formed on parts of the copper wirings 108 with paste composition containing 85-99wt.% of gold, a process in which the patterns made of the paste composition containing 85-99wt.% of gold are baked at a baking temperature of 550-750 deg.C to form the wirings 112 whose main component is gold and a process in which a semiconductor device 105 is electrically connected to the wirings 112 whose main component is gold are provided.