| 摘要 |
PURPOSE:To enable a bump to be easily formed with a simple device without using a large-scale equipment by a method wherein a copper bump is formed on a semiconductor device by ball bonding, and solder is attached to the surface of the copper bump through an electroless solder plating method. CONSTITUTION:A wire bonder main body 35 is capable of moving a capillary 16 which holds a copper wire 15 in the directions of X, Y, and Z axis basing on the control data of a control section 37. A copper wire 15 30mum in diameter is prepared, the wire bonder 35 is so set in sparking conditions as to form a copper ball 15A 80mum in diameter, and a ball bonding operation is performed direct onto an aluminum pad 2. At this point, an aluminum oxide 3 covering the aluminum pad 2 located under a copper wire is removed off at bonding to keep the aluminum pad 2 excellent in electric contact with a copper ball. In succession, solder is attached to the copper ball through an electroless solder plating method. Thereafter, flux is applied to the solder, fused by heating, and cleaned off to finish the formation of a copper bump. |
