| 摘要 |
PURPOSE:A first frame is transferred at high speed to a first bonding stage. Next, a second frame is transferred at high speed to a second bonding stage. Each frame is transferred onto each bonding stage by a preset pitch to obtain a bonding device with more than two bonding heads mounted. CONSTITUTION:When a first frame reaches directly under a roller 45a, the roller 45a descends to contact the frame. When the roller 45a drives in rotation so that the frame reached a preset position, a second frame projects to outside a magazine M and the frame reaches directly under a roller 43 of a substrate transport device. Thereafter, rollers 43a and 44a descend to contact the frame and the frame driven in rotation is transferred at high speed. Each frame sent at high speed by substrate transport devices 43 and 46 is transferred at low speed intermittently by a preset pitch by substrate transport devices 51 and 52 and bonding is performed. |
