发明名称 COLLET FOR SEMICONDUCTOR PARTS
摘要 <p>PURPOSE:To provide a collet used to mount semiconductor devices in such a manner that they adjoin one another. CONSTITUTION:A collet includes a tapered square recess in one end to receive a semiconductor device 5 by suction. The square recess has walls on three sides and one open side 3. When received in the recess, a semiconductor device is in contact with the three walls at its three edges, and the remaining edge protrudes beyond the open side of the recess. This makes it possible to mound adjacent semiconductor devices in contact with each other, thus making it possible to make small-size products and minimizing the distance of wire bonding so that manufacturing cost can be greatly reduced.</p>
申请公布号 JPH07176551(A) 申请公布日期 1995.07.14
申请号 JP19930317597 申请日期 1993.12.17
申请人 NEC CORP 发明人 ONODERA TAKAO
分类号 B25J15/06;H01L21/52;H01L21/677;H01L21/68;(IPC1-7):H01L21/52 主分类号 B25J15/06
代理机构 代理人
主权项
地址