| 摘要 |
PURPOSE:To realize quick connection by picking a plurality of positioned bare chips at the same time, supplying them together on one face of a lead frame with an interval of specified pitch and jointing a group of bare chips with the lead frame. CONSTITUTION:Bare chips 1 are supplied in a line to an integrating zone 76 side by a chip supply unit 70, and a plurality of bare chips 1 are positioned with an interval of specified pitch P by a positioning device 77. The positioned plurality of bare chips 1 are picked at the same time by a picking device 40. Then, they are supplied together onto one face of a lead frame 5 with an interval of specified pitch P and a group of bare chips are jointed with the frame 5. Thus, bare chips can be jointed with a lead frame efficiently, easily and at a high speed. |
