发明名称 PHOTOSENSITIVE RESIN COMPOSITION
摘要 PURPOSE:To obtain a positive photosensitive resin composition enhanced in resolving power, having a good pattern and practical sensitivity and high heat resistance and with the performances well-balanced by using plural specified photosensitive compds. at the same time. CONSTITUTION:This photosensitive resin composition contains an alkali-soluble resin, a quinone diazide-base photosensitive compd. and solvent. The photosensitive compd. has 600-2200 weight average mol.wt. and contains the quinone diazide sulfonic ester of the novolac resin shown by formula I or II and the quinone diazide sulfonic ester of hydroxylbenzophenones shown by formula III. In the formulas, R<1> and R<4> are respectively alkyls, R<2> is alkyls or aryls, R<3> is hydrogen atom or alkyls, R<5> is hydroxyl or alkyls, R<6> and R<9> are hydrogen atom, alkyls or aryls, R<7> and R<10> are respectively hydrogen atom or alkyls, and R<8> is alkyls.
申请公布号 JPH07175214(A) 申请公布日期 1995.07.14
申请号 JP19940265500 申请日期 1994.10.28
申请人 MITSUBISHI CHEM CORP 发明人 NISHI MINEO;NAKANO KOJI;NAKANO KEISUKE;MATSUO IWAO
分类号 H01L21/027;G03F7/022;G03F7/023;(IPC1-7):G03F7/022 主分类号 H01L21/027
代理机构 代理人
主权项
地址