| 摘要 |
PURPOSE:To increase the operating efficiency of bond coating means and a bonding head by chucking two sheets of lead frames simultaneously with chuck clicks and simultaneously coating bond and chip mounting by a bonding head while feeding by a pitch. CONSTITUTION:First transport means 20 carries a lead frame 1 supplied from a stocker 12 onto guide rails 11a and 11b toward a dispenser 51. Second transport means 30 carries the lead frame 1 carried by the first transport means 20 toward a bonding head 61 by pitch movement. The second transport means 30 has a plurality of chuck clicks 38 and 39 which chuck two lead frames simultaneously, and with these chuck clicks 38 and 39, two lead frames are simultaneously moved by a pitch while coating an island 1a with bond and chip packaging are performed at the same time. This enables the operating efficiency of bond coating means and the bonding head to be increased. |
