| 发明名称 |
Circuit connection in an electrical assembly. |
| 摘要 |
An electrical assembly comprises an electrical component 11 having an array of contact bumps 18. The component 11 is mounted on a multilayer printed circuit board 12 having a plurality of conducting pins 28 located in holes in the board 12 and having pointed ends 29 projecting above the board and making electrical contact with the bumps 18 on the component 11. <IMAGE> |
| 申请公布号 |
EP0662732(A1) |
申请公布日期 |
1995.07.12 |
| 申请号 |
EP19950300121 |
申请日期 |
1995.01.10 |
| 申请人 |
SGS-THOMSON MICROELECTRONICS LTD. |
发明人 |
WAKEFIELD, ELWYN PAUL MICHAEL |
| 分类号 |
H01R4/24;H01L23/488;H01L23/498;H01R11/01;H01R12/57;H01R13/24;H01R33/76;H05K1/18;H05K3/32;H05K7/10 |
主分类号 |
H01R4/24 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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