| 发明名称 |
A hermetic package for a high power semiconductor device. |
| 摘要 |
<p>A compact package and a method of hermetically packaging a high power semiconductor device (10) includes a metal lid (14) bonded to a ceramic base (16) with the semiconductor device therebetween. The lid is bonded to one surface (28) of the device, and electrical contacts (22) on the opposing surface (24) of the device are bonded to foils (38) that seal openings (36) in the base for contact pins (42). <IMAGE></p> |
| 申请公布号 |
EP0662711(A1) |
申请公布日期 |
1995.07.12 |
| 申请号 |
EP19940120977 |
申请日期 |
1994.12.30 |
| 申请人 |
HARRIS CORPORATION |
发明人 |
TEMPLE, VICTOR A. K.;GLASCOCK, HOMER H. II |
| 分类号 |
H01L23/13;H01L21/50;H01L23/02;H01L23/04;H01L23/049;H01L23/055;(IPC1-7):H01L23/04 |
主分类号 |
H01L23/13 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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