Thermocompression bonding using an aluminium-gold intermetallic.

摘要

A method of bonding a metal or metalized foil (10) to an aluminum contact pad (14,16) on a semiconductor chip (12) using thermocompression, and devices manufactured using the method. One side of the foil is first coated with a thin barrier layer of chromium and then coated with a thin layer of gold. When the gold layered foil is thereafter thermocompressed onto the contact pad, substantially all of the gold in contact with the aluminum in the contact pad reacts to form AuAl2 to thereby bond the foil to the contact pad.