发明名称 Method of manufacturing semiconductor device
摘要 A method of manufacturing a semiconductor device, which comprises steps of providing a substrate, forming an oxide layer of a metal material, which includes a tantalum or an alloy mainly containing a tantalum on the substrate, placing the substrate into a first chamber, activating an etching gas which includes a fluorine containing gas and an oxygen containing gas, in a second chamber, introducing the activated etching gas into the second chamber, and etching the oxide layer by the introduced gas selectively against the substrate. A method of manufacturing a liquid crystal display device, which comprises steps of providing a substrate, forming an anodic oxide layer of a tantalum containing material on the substrate, forming an etching mask on the anodic oxide layer, placing the substrate into a first region, activating a mixture of fluorine and oxygen containing gas in a second region, apart from the first region, introducing the activated etching gas into the first region through a gas introducing portion, and etching the oxide layer on the substrate selectively against the substrate, by using the etching mask.
申请公布号 US5431773(A) 申请公布日期 1995.07.11
申请号 US19920991954 申请日期 1992.12.17
申请人 发明人
分类号 G02F1/136;G02F1/1362;G02F1/1368;H01L21/02;H01L21/302;H01L21/3065;H01L21/311;H01L21/336;H01L21/77;H01L21/84;H01L29/49;H01L29/78;H01L29/786;(IPC1-7):C23F1/00 主分类号 G02F1/136
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