Method and apparatus for fabrication of multibeam lasers

摘要

The present invention is a multispot laser light source assembled from at least two individual laser diodes in accordance with a design model. The multispot laser includes at least two semiconductor laser diodes, both of which are permanently affixed to a chip carrier. The chip carrier rigidly supports the diodes and conducts heat away from the the diodes to be dissipated by a heat sink. The present invention is further characterized by a predefined relationship between the chip carrier material, the relative dimensions of the chip carrier, and the separation distance of the diodes from the heatsink, which results in significant reduction in the thermal droop and crosstalk between the diodes.