发明名称 Method and system for plasma treatment
摘要 A plasma treatment method and system allowing the plasma intensity to be controllably distributed perpendicularly to the inner wall and ensuring effective and uniform treatment in the case of executing plasma cleaning, plasma CVD, RIE or the like. In the plasma treatment where plasma is generated within a chamber 1 for plasma treatment, magnetic field 31 is applied perpendicularly to the inner wall of the chamber to produce plasma whose intensity is directed perpendicularly to the inner wall of the chamber or in parallel with the surface to be treated. Further, the magnetic filed 31 rendered into a revolving field 32 may be applied to rotate the plasma to accomplish a uniform and effective treatment.
申请公布号 US5431769(A) 申请公布日期 1995.07.11
申请号 US19930140455 申请日期 1993.10.25
申请人 SONY CORPORATION 发明人 KISAKIBARU, TOSHIRO;KOJIMA, AKIRA;FUKUNAGA, TAKAYUKI;HATA, YOSHINORI;KATO, YASUSHI;HONBORI, ISAO;JOZAKI, TOMOHIDE;KOORIYAMA, HIROHISA
分类号 C23C16/50;C23C16/511;C23F4/00;H01J37/32;H01L21/205;H01L21/302;H01L21/3065;H01L21/31;(IPC1-7):H05H1/00 主分类号 C23C16/50
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