| 摘要 |
PURPOSE:To very easily and efficiently carry out electroless plating treatment of a polyamide fiber and obtain an electroless-plated fiber excellent in the adhesion of the plating film to the polyamide fiber. CONSTITUTION:A polyamide fiber is treated with tannic acid and subjected to electroless plating treatment to produce the objective electroless-plated fiber. In other way, a polyamide fiber is treated with tannic acid, catalyzed and subjected to electroless plating treatment to produce the objective electroless- plated fiber. |
