发明名称 HEAT-RESISTANT POLYESTER RESIN MOLDING HAVING LOW RESIDUAL STRESS
摘要 PURPOSE:To provide a heat-resistant polyester resin molding having both good heat resistance and low residual stress by using a composition comprising a mixture of a polybutylene terephthalate resin, a polyethylene terephthalate resin and an olefin copolymer at a specified ratio. CONSTITUTION:This molding is made from a composition consisting of 100 pts.wt. polybutylene terephthalate resin (referred to as PBT hereinafter), 0-50 pts.wt. polyethylene terephthalate resin and 25-50 pts.wt. olefin copolymer, of which the displacement due to softening near the melting point accounts for at least 15% of the total displacement from the state at ordinary temperature, the central value of the softening temperature near the melting point is at least 225 deg.C, the residual stress at ordinary temperature after being subjected to a given strain at 150 deg.C is at most 80% of that of the PBT. As the olefin copolymer, one obtained by grafting 100 pts.wt. polyolefin with 0.001-10 pts.wt. unsaturated carboxylic acid and/or derivative thereof is preferably used.
申请公布号 JPH07173297(A) 申请公布日期 1995.07.11
申请号 JP19930318497 申请日期 1993.12.17
申请人 POLYPLASTICS CO 发明人 AOKI HIROSHI;WATANABE MASAHARU;AOSHIMA HIRONOBU
分类号 C08J5/00;B29C51/08;B29K23/00;B29K67/00;C08L67/00;C08L67/02;(IPC1-7):C08J5/00 主分类号 C08J5/00
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