发明名称 |
Conductive adhesive for use in a circuit board |
摘要 |
A double-sided printed circuit board and a method for making the circuit board. The circuit board includes a metal support that functions as both a heat sink and a ground plane. The circuit board contains a dielectric having first and second conductive foil platings on opposing sides of the dielectric. Prior to bonding the first foil plating to the metal support with a conductive adhesive, a standard protective coating on the first foil plating, which typically remains on the foil plating in conventional practice, is removed in order to expose a bare surface of the first foil plating. The exposed bare surface of the first foil plating is then bonded to the metal support before any substantial oxidation or a build up of impurities on the first foil plating surface can occur.
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申请公布号 |
US5432303(A) |
申请公布日期 |
1995.07.11 |
申请号 |
US19940296324 |
申请日期 |
1994.08.25 |
申请人 |
POLY CIRCUITS, INC. |
发明人 |
TUREK, JOSEPH A.;DRYER, JOEL S.;SEXSON, HAROLD L. |
分类号 |
H05K1/02;H05K1/03;H05K1/05;H05K3/00;H05K3/32;H05K3/38;H05K3/42;(IPC1-7):H05K1/02 |
主分类号 |
H05K1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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