发明名称 |
Socket for IC package |
摘要 |
A receiving tray 6 is disposed on a pedestal surface 1a of a base member 1 vertically and movably, while below the pedestal surface 1a are disposed a push-up member 7 interlocked with the receiving tray and a spring 8 for urging the push-up member 7 downwards. A seating surface if for package leads P2 is formed along side portions of the pedestal surface 1a, and a large number of contacts 2 are arranged side by side, the contacts 2 having respective contact portions 2a for contact with the leads P2 which contact portions 2a are urged inwards to obtain a predetermined contact pressure for the leads. There are used movable cams 4 adapted to rotate upon depression of a cover 5 which covers the base member, to displace the contact portions 2a of the contacts 2 outwards away from the package leads P2. The movable cams 4 are each provided with an actuating arm 4c which comes into abutment with the push-up member 7 upon depression of the cover 5 and consequent rotation of the cam 4 to push up the receiving tray 6.
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申请公布号 |
US5431579(A) |
申请公布日期 |
1995.07.11 |
申请号 |
US19940272840 |
申请日期 |
1994.07.11 |
申请人 |
CHICHIBU FUJI CO., LTD. |
发明人 |
KISHI, NOBUAKI;ARAI, NOBUHISA;TAKAGISHI, MASANORI;HENMI, HIROSHI |
分类号 |
H01L23/32;G01R1/04;H01R33/76;H05K7/10;(IPC1-7):H01R11/22 |
主分类号 |
H01L23/32 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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