| 摘要 |
PURPOSE:To develop a tin-base plating metallic material less in the deterioration of solderability and excellent in corrosion resistance at the time of plating a metallic material with tin or tin-based alloy by surface-treating the material with a processing soln. contg. a specified org. compd. as an inhibitor. CONSTITUTION:When the surface of a base material of ferrous or cupreous metal is plated with Sn or Sn-Pb alloy, the base material is dipped in a processing soln. prepared by dissolving 0.001-1wt.% of one or >=2 kinds among the benzotriazole, mercaptobenzothiazole and triazine shown by the formulas I to III as an inhibitor in water or org. solvent such as ethanol or in the processing soln. further contg. a nonionic surfactant such as polyoxyethylenenaphthyl ether, or the processing soln. is sprayed or applied. The deterioration of the solderability of the Sn or Sn-Pb alloy plated member on aging is reduced, and the corrosion resistance and appearance are improved. |
