发明名称 Wafer drying apparatus and fire-extinguishing method therefor
摘要 A wafer drying apparatus incorporated in a semiconductor wafer cleaning system includes a bath for storing IPA. A heater for generating an IPA vapor is arranged on the bath. The bath is surrounded by a housing. The housing has opening portions at three positions. The opening portions are opened/closed by shutters. A sensor for detecting a fire and a nozzle for discharging CO2 gas into the bath are arranged around the bath. A plurality of wafers are held by a chuck of a convey robot and are conveyed from the outside of the housing into the housing via the opening portions. When a fire is detected by the sensor, the chuck immediately retreats from the housing, and the shutters are closed. Signals for closing the shutters are transmitted to shutter drive sources again 10 seconds after the fire is detected, and discharging of CO2 gas is started 20 seconds after the fire is detected.
申请公布号 US5431179(A) 申请公布日期 1995.07.11
申请号 US19940197285 申请日期 1994.02.16
申请人 TOKYO ELECTRON LIMITED;TOKYO ELECTRON KYUSHU LIMITED 发明人 MIYAZAKI, TAKANORI;KOBAYASHI, KAZUHIKO;KAMIKAWA, YUUJI;TASHIMA, CHIHAYA
分类号 F26B21/14;F26B25/00;H01L21/00;H01L21/304;H01L21/677;(IPC1-7):B08B13/00 主分类号 F26B21/14
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