发明名称 THIN FILM TYPE THERMAL HEAD
摘要 <p>PURPOSE:To enhance high speed operation and reliability of a thermal head, by using a mixture of SiC and SiO2 as an abrasion resistant film. CONSTITUTION:Glass 2 is glazed on insulating substrate 1, such as Al2O3. On this, heating resistor 3, such as Si-Ta alloy is formed, and further on this, electrode 4, such as Cr-Au is provided for energizing resistor 3. On these, sputtering is effected with a SiC target in an argon gas containing O2 to form protective film 5 made of Sic-SiO2. Since this is operated at a temperature of substrate 1 where alloy formation of resistor 3 and electrode 4 does not occur, no crack occurs on the SiC abrasion resistant film. The abrasion resistance of film 5 slightly decreses, but formation of 1-2 mu thick SiC film on film 5 permits the abrasion resistance to little be lowered.</p>
申请公布号 JPS5485734(A) 申请公布日期 1979.07.07
申请号 JP19770154008 申请日期 1977.12.20
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 KURAMASU KEIZABUROU;MAEKAWA SUMIO;ARAI MASAJI
分类号 H01C7/00;B41J2/335;H01C7/18;H01L49/02 主分类号 H01C7/00
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