发明名称 PROCESS AND DEVICE FOR ELECTROLYTIC PRECIPITATION OF METALLIC LAYERS
摘要 No soluble anodes are used in the electrolytic precipitation of uniform metallic layers having determined physico-mechanical properties, in particular copper layers, as the geometric form of soluble anodes is modified by precipitation and the field line distribution in the electrolytic cells continuously changes. In order to solve the resulting problems, a process is disclosed according to which compounds of a redox system added to the precipitation solution are reacted during precipitation at the insoluble anodes. The resulting compounds draw new metal ions out of part of the reservoir that contains the metal to be precipitated in order to replace the metal ions precipitated from the solution. A process is thus disclosed in which the additive compounds are not destroyed, contrary to the state of the art.
申请公布号 WO9518251(A1) 申请公布日期 1995.07.06
申请号 WO1994DE01542 申请日期 1994.12.23
申请人 ATOTECH DEUTSCHLAND GMBH;MEYER, HELGA +HF;FROMME, PETRA +HF;KAFTANSKI, SILKE +HF;SCHUMACHER, ROLF;DAHMS, WOLFGANG;SCHNEIDER, REINHARD 发明人 MEYER, WALTER +DI;SCHUMACHER, ROLF;DAHMS, WOLFGANG;SCHNEIDER, REINHARD
分类号 C25D3/38;C25D21/14 主分类号 C25D3/38
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