Verfahren zum Aufbau einer Leiterplatten-Anordnung von hoher Leistungsfähigkeit.

摘要

The invention features a method of constructing a high performance printed circuit board assembly utilizing a modular construction technique. Sub-assemblies (10) are first constructed, tested, and then subsequently incorporated into the final circuit board assembly (20) which has a triplate geometry. Lamination of the modular sub-assemblies minimizes dielectric core thickness.