| 摘要 |
<p>The invention relates to a method and pellet for encapsulating lead frames (5). Prior to applying pressure to a pellet (6) a plastic foil (11) is placed between the pellet (6) and a plunger (10). The pellet (6) is characterized in that it consists of a body of encapsulating material (e.g. epoxy) and a plastic layer connected thereto. The invention further relates to a device for manufacturing such a pellet (6).</p> |
