| 摘要 |
PURPOSE: To form a wiring board with a new architecture by forming a number of bonding pads at the upper portion of a region of a substrate, where a plurality of cells are formed, placing a plurality of integrated circuit chips at the cells, and electrically connecting them. CONSTITUTION: A plurality of cells 106-1, 1-106-S, T are formed on a programmable wiring board 105, and pads 107-1-107M are formed at the upper portion of the cells. Horizontal and vertical conductive tracks 108-1-J and 109-1-K are formed at the second and first heights of the substrate 105, each cross point of the horizontal and vertical tracks 108 and 109 is formed in a programmable connection structure such as an anti-fuse, and an anti-fuse element that is an external lead and is located at the cross point can be programmed according to the design conditions. The vertical and horizontal leads 109-1-K and 108-1-J are formed on the substrate 105 so that they cross one cell 106 or all the cells at the maximum, thus forming a substrate for forming a specific configuration of adjacent conductive leads 108 and 109 across one cell. |
