发明名称 MULTILAYER WIRING BOARD
摘要 PURPOSE:To enable a multilayer rigid board and a flexible board both to thin down and easily, quickly connected together or disconnected from each other. CONSTITUTION:A cutout 25 where the top electrode of a flexible board is fitted in a detachable manner is provided to the side of a middle rigid board 21 out of a rigid board 10 sandwiched between the outermost rigid boards 11 and 31, and fixed electrodes 15 and 35 are provided to make the outermost rigid boards 11 and 31 register the cutout 25.
申请公布号 JPH07170076(A) 申请公布日期 1995.07.04
申请号 JP19930316143 申请日期 1993.12.16
申请人 TEC CORP 发明人 OTANI MASAHIRO
分类号 H05K1/14;H05K3/00;H05K3/36;H05K3/46 主分类号 H05K1/14
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