| 摘要 |
<p>PURPOSE:To detect the state of the soldering of the front ends of leads for a semiconductor device without damaging the electrical characteristics of the semiconductor device by X-ray irradiation inspection in a user by mounting the display of a surface capable of being irradiated with X-ray on the surface of a package and installing an X-ray filter between an X-ray irradiating surface and a semiconductor chip. CONSTITUTION:When the top face, a semiconductor device 1, of a package 2 is mounted on a mounting substrate, a mark 40 is formed on a part of the exposed top face. An X-ray filter 13 is formed onto an insulating film 12. The X-ray filter 13 consists of a metallic layer such as an aluminum layer. The X-ray filter 13 covers a section just under a wire bonding pad 32 and the whole regions except a peripheral section, an active region 11. A semiconductor chip 7 is absorbed in the presence of the X-ray filter 13 when a fixed quantity of X-ray 35 are applied from the active region 11 side, thus preventing the damage of a MOSFET in the active region 11.</p> |
