| 摘要 |
<p>PURPOSE:To provide a circuit board which can always constitute a multi chip module or the like of high reliability, by resolving or reducing the warp generation in a ceramic based multilayered wiring part constituting a base board. CONSTITUTION:A circuit board consists of the following; a ceramic based multilayered wiring part 8 in which wiring layers 8a are laminated via insulating layers 8b, a this film wiring part 9 which is integrally formed on the multilayered wiring part 8 and constituted by laminating wiring layers 9a via insulating layers 9b, and a metal shield ring layer 8d for hermetic seal which is arranged on the multilayered wiring part 8 surface so as to surround the thin film wiring part 9. A stress buffering layer 8e is formed on the rear of the multilayered wiring part 8 so as to correspond almost with the metal shield ring layer 8d. The stress buffering layer 8e is composed of metal material having property identical or approximate to the forming material of the metal shield ring. The warp generation in the circuit board is resolved by arranging the stress buffering layer 8e.</p> |
