发明名称 |
MANUFACTURE OF MULTI-LAYER LEAD FRAME |
摘要 |
<p>PURPOSE:To improve the yield by remarkably reducing the manufacturing steps, to maintain high reliability by abuting possibility in generation of factors of failure and to remarkably lower the production cost by preventing generation of reflow cracks after the molding. CONSTITUTION:A method of manufacturing a multi-layer lead frame comprises the steps for mounting a metal plate 2 having formed a bonding layer 3 of the predetermined thickness by coating both surfaces thereof with a bonding agent on a punching stage 5, punching the metal plate 2 in the predetermined shape and attaching the metal plate 2 to a lead frame 1 which is previously heated up to a glass transition temperature of the bonding agent through a bonding layer 3.</p> |
申请公布号 |
JPH07169894(A) |
申请公布日期 |
1995.07.04 |
申请号 |
JP19930341955 |
申请日期 |
1993.12.13 |
申请人 |
HITACHI CABLE LTD |
发明人 |
OTAKA TATSUYA;KAMEYAMA YASUHARU;AKINO HISANORI;TAKAHAGI SHIGEJI;YONEMOTO TAKAHARU |
分类号 |
B21D28/00;H01L23/50;(IPC1-7):H01L23/50 |
主分类号 |
B21D28/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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