| 摘要 |
PURPOSE:To prevent a situation that an active layer for an IC chip is damaged by a pin, for a molding metal mold, which restrains the movement of the IC chip in a resin sealing operation. CONSTITUTION:At least an active layer for an IC chip 1 is covered, to be thick, with a protective film 25 which is composed of a polyimide or the like. In addition, the IC chip 1 is sealed with a resin by using a molding metal mold in which fixed or movable pins 90 which regulate the up-and-down movement of the IC chip 1 inside the molding metal mold are constituted of a soft material such as TEFLON, rubber or the like. |
