| 摘要 |
PURPOSE:To manufacture, at low cost, a lead-on-chip(LOC) package in which a metal lead has been formed on the circuit face of a semiconductor chip. CONSTITUTION:Inner leads 107 as inside parts of metal leads are formed at the upper part of a plurality of electrodes 104 on the surface of a semiconductor chip 102, and they face the electrodes in a one-to-one manner. A semiconductor chip is bonded to the inner leads by an anisotropic conductive film 108. The electrodes and the inner leads which face the electrodes keep an electrical continuity by conductive particles 109 which are contained in the anisotropic conductive film. The anisotropic conductive film is a connecting material in which fine conductive particles have been dispersed in an adhesive film, the conductive particles electrically connect the electrodes and fix the electrodes mechanically by an adhesive. Thereby, the mechanical bonding operation of the semiconductor chip to the inner leads and the electrical bonding operation of the electrodes on the surface of the semiconductor chip to the inner leads can be performed in one process. |
