| 摘要 |
PURPOSE:To provide a bonding inspection apparatus, which can accurately inspect whether a lead wire is normally bonded or not without missing the detection of defective parts out of a specified tolerance and without dependence on inspector's skill level in inspection accuracy. CONSTITUTION:The image of the bonding part of a lead wire 13, which is bonded to an electrode pad 12a of a semiconductor chip 12, is photagraphed with a CCD camera 15. The output of the CCD camera 15 is inputted into a main body 18 of an inspecting apparatus. It is judged whether the width of the bonding part is within a specified tolerance or not. |
