发明名称 MANUFACTURE OF PRINTED WIRING BOARD
摘要 PURPOSE:To surely prevent a connection failure from occurring between an inner conductor circuit and a through-hole so as to improve a printed wiring board in connection reliability. CONSTITUTION:A through-hole forming hole 3 is bored in a board 1 provided with an inner conductor circuit 1a. Copper plating 4 is deposited on a part of the inner conductor circuits 1a exposed out of the inner wall of the through- hole forming hole 3. Pd catalyst nuclei 5 are applied onto the inner wall surface 3a of the through-hole forming hole 3, and a through-hole plating 7 is deposited on all the inner wall surface 3a of the through-hole forming hole 3 by electroless copper plating.
申请公布号 JPH07170078(A) 申请公布日期 1995.07.04
申请号 JP19930317048 申请日期 1993.12.16
申请人 IBIDEN CO LTD 发明人 ONO ISAMU;WATANABE MIKIO;OKUMURA MANABU
分类号 H05K3/42;H05K3/46;(IPC1-7):H05K3/46 主分类号 H05K3/42
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