发明名称 |
MANUFACTURE OF PRINTED WIRING BOARD |
摘要 |
PURPOSE:To surely prevent a connection failure from occurring between an inner conductor circuit and a through-hole so as to improve a printed wiring board in connection reliability. CONSTITUTION:A through-hole forming hole 3 is bored in a board 1 provided with an inner conductor circuit 1a. Copper plating 4 is deposited on a part of the inner conductor circuits 1a exposed out of the inner wall of the through- hole forming hole 3. Pd catalyst nuclei 5 are applied onto the inner wall surface 3a of the through-hole forming hole 3, and a through-hole plating 7 is deposited on all the inner wall surface 3a of the through-hole forming hole 3 by electroless copper plating. |
申请公布号 |
JPH07170078(A) |
申请公布日期 |
1995.07.04 |
申请号 |
JP19930317048 |
申请日期 |
1993.12.16 |
申请人 |
IBIDEN CO LTD |
发明人 |
ONO ISAMU;WATANABE MIKIO;OKUMURA MANABU |
分类号 |
H05K3/42;H05K3/46;(IPC1-7):H05K3/46 |
主分类号 |
H05K3/42 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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