| 摘要 |
PURPOSE:To provide a highly reliable and peeling-free wiring board which is utilized for various electronic equipments. CONSTITUTION:A wiring board is formed into a structure, wherein conductive layers, which consist of a first Cr layer 2, a Cu layer 3 and a second Cr layer 4, and an insulating layer 5 which covers these conductive layers are formed on an insulative substrate 1, and that the layer 4 is formed by heat treatment in a vacuum immediately before the layer 5 is formed, thereby improving the adhesion of the conductor layers to the substrate 1. |
