发明名称 Method of heat treating a substrate with standby and treatment time periods
摘要 A method of heat-treating a substrate to be loaded/unloaded to and from a substrate heating device for a prescribed time period cycle including the steps of transferring the substrate from a substrate conveying robot to a substrate transferring and receiving device, holding the received substrate in a position where it is subjected to only a limited influence of heating by a hot plate for a first time period prior to transferring the substrate to the hot plate, heating the substrate by the hot plate for a second time period, and removing the substrate from the hot plate by the substrate conveying robot after the second time period elapses. Preferably, the sum of the first time period and the second time period approximately equals the cycle time period.
申请公布号 US5430271(A) 申请公布日期 1995.07.04
申请号 US19930165531 申请日期 1993.12.13
申请人 DAINIPPON SCREEN MFG. CO., LTD. 发明人 ORGAMI, NOBUTOSHI;FUKUTOMI, YOSHITERU
分类号 H01L21/30;H01L21/00;H01L21/027;H01L21/304;H01L21/677;H01L21/683;(IPC1-7):H01L21/68 主分类号 H01L21/30
代理机构 代理人
主权项
地址