| 摘要 |
PURPOSE:To make a semiconductor device thin and to make an injection balance good in a resin sealing operation by a method wherein a part in which an IC element is to be fixed, by using an insulating adhesive tape or an insulating adhesive, onto the surface of a lead-frame inner lead part is formed in the downward direction. CONSTITUTION:Parts in which an IC element 3 is to be fixed, by using an insulating adhesive tape or an insulating adhesive 4, onto the surface of lead- frame inner leads 2 are formed 7 to the downward direction. Then, the IC element 3 is fixed and bonded to an IC-element mounting part at the lead-frame inner leads 2 which have been formed 7 to the downward direction, and wire bonding pads at the IC element 3 and the lead-frame inner leads 2 are connected by wires 5. Then, a lead frame is set on a metal mold in a resin-sealing molding process, a resin is injected, and the IC element is sealed. Lastly, lead-frame outer leads 6 are bent in a press process, they are cut, and terminals for a semiconductor element are formed.
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