ELECTRONIC CIRCUIT DEVICE, MANUFACTURE THEREOF, CIRCUIT BOARD, LIQUID CRYSTAL DISPLAY DEVICE, THERMAL HEAD, AND PRINTER

摘要

PURPOSE:To obtain a highly reliable connection whereby a semiconductor element and a board are connected and which has a large connective strength, a high allowable current value and a low connective resistance, by connecting the semiconductor element with the board through the solid phase diffusion performed between a bump formed on the semiconductor element and a wiring formed on the board, while mounting facedown the semiconductor element on the board in a short time and with a high mounting density. CONSTITUTION:In a semiconductor device wherein a semiconductor element 51 mounted facedown on a glass board 53 configuring a flat display or on a ceramic board 53 configuring a thermal head, the semiconductor element 51 is bonded to the board 53 through a solid phase diffusion performed between a bump 52 formed on the semiconductor element 51 and a wiring 54 formed on the board 53.