发明名称 |
MOUNTING METHOD OF ELECTRONIC COMPONENT AND HOUSING MEMBER OF FILM CARRIER |
摘要 |
PURPOSE:To mount a film carrier on a board with high reliability by preventing the electrical connection defect of the film carrier to the board from being caused. CONSTITUTION:Film carriers 1 formed in such a way that electronic components are mounted on flexible tapes are positioned and housed inside a recessed part 9 one by one inside many individual housing recessed parts 8 formed so as to match the shape of every film carrier 1 in the length direction of a resin tape 7 while they escape in such a way their electronic-component mounting parts or their electronic-component mounting parts and molded outer leads do not come into contact with the resin tape 7. Then, the film carriers 1 are taken out from the housing recessed parts 8 in the resin tape 7, and they are mounted on a board 10. Thereby, it is possible to prevent a defective electrical connection due to dust particles on the film carriers 1. |
申请公布号 |
JPH07170091(A) |
申请公布日期 |
1995.07.04 |
申请号 |
JP19930312954 |
申请日期 |
1993.12.14 |
申请人 |
MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
AKIGUCHI NAOSHI;NISHIDA KAZUTO |
分类号 |
B23P19/00;B23P21/00;B65B15/04;B65D73/02;B65D85/86;H05K13/00;H05K13/02 |
主分类号 |
B23P19/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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